12.3 9.0 5.6125 a a front view 21.0000 28.1 top view 1.29 0.84 8.00 8.00 section a-a ghz bga socket - direct mount, solderless features ? directly mounts to target pcb (needs tooling holes) with hardware ? high speed, reliable elastomer connection ? minimum real estate required ? compression plate distributes forces evenly ? ball guide prevents over compression of elastomer ? easily operable snap socket spring lid ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: sg-bga skt 5x5mm 0.65mm pitch 7x7 array primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 11/20/2013 material: n/a finish: n/a weight: 12.22 CG-BGA-5020 drawing scale: 2:1 sheet: 1 of 4 eng: v. panavala file: CG-BGA-5020 dwg drawn by: m. raske
0.850.025 (x2) non plated alignment hole 3.90 (x4) 12.2250.125 socket base size 0.65 typ. 1.95 (x2) 0.35 (x34) 1.7100.100 thru non plated hole 1.8625 2.8625 1.70 4.8625 (x8) 1.25 1.25 orientation mark 0.025 a b 0.035 a b 4.0 (x2) 2.0 (x2) 2.75 (x4) 5.5125 2.0125 4.5125 1.0125 20.2250 28.2250 11.0 3.00 1.25mm max component ht. zero keep out area 1.25mm max component ht. 0.65mm max component ht. *note: bga pattern is not symmetrical with respect to the mounting holes. the pattern is shifted to the right of center by 0.25mm. target pcb recommendations total thickness: 1.6mm min. plating: gold or solder finish pcb pad height: same or higher than solder mask note: full bga pattern shown. please adjust pattern according to individual requirement. ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: recommended pcb layout primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 11/20/2013 material: n/a finish: n/a weight: 12.22 CG-BGA-5020 drawing scale: 4:1 sheet: 2 of 4 eng: v. panavala file: CG-BGA-5020 dwg drawn by: m. raske
d e pin a1 top view bottom view side view 3. 4. 5. 0.1 z 0.1 z x y e b 3.9000 3.9000 pin a1 0.15 m x y z a a1 0.20 z 0.05 z z dimendions are in millimeters. interpret dimensions and tolerances per asme y14.5m-1994. 1. dimension b is measured at the maximum solder ball diameter, parallel to datum plane z. 2. datum z (seating plane) is defined by the spherical crowns of the solder balls. 3. parallelism measurement shall exclude any effect of mark on top surface of package. 4. array: 7x7 ironwood package code: bga49d dim min max a 1.5 a1 0.17 b 0.25 0.35 d 5.00 e 5.00 e 0.65 bsc ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: bga primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 11/20/2013 material: n/a finish: n/a weight: 12.22 CG-BGA-5020 drawing scale: 15:1 sheet: 3 of 4 eng: v. panavala file: CG-BGA-5020 dwg drawn by: m. raske
12.2250 9.7250 (x4) 1.5250 1.5250 2.51 (x4) 2.6125 (x2) 2.50 4.00 1 4 2 7 6 15 5 8 3 14 18 16 17 12 9 10 11 13 19 iso view backing plate specification item no. description material 1 test chip 5x5mm 0.65mm pitch 7x7 array material 2 0.5mm thick, 0.05x 0.05mm pitch, 50mm sqr, z-axis conductive angled elastomer 20 micron dia gold plated brass filaments arranged symettrically in a silicon rubber (63.5 degree angle), thickness: 0.5mm 3 alignment pin 1/32" dia. x 1/8" lng chrome stainless steel 4 ball guide 0.65mm pitch 7x7 array kapton polyimide/cirlex 5 #0-80 x .375 lg, soc hd cap screw, alloy stl, blk oxide alloy steel 6 ic guide 5x5mm ic kapton polyimide/cirlex 7 elastomer guide 5x5mm kapton polyimide/cirlex 8 target pcb 5x5mm 0.65mm pitch 7x7 array fr4 standard 9 12mm plastic snap clamshell socket lid pps/ultem 10 clamshell latch snap lid socket (modified m2695 latch) pps/ultem 11 snap ring for 2mm hinge pin 0.15" od 12 2mm diameter hinge pin, 20 mm long alloy steel 13 torsion spring, 180 0.109" od, ccw/rh steel music wire 14 clamshell cg socket base 7x7mm 7075-t6 aluminum alloy 15 clamshell backing plate, 7mm ic 5 post "h" shaped 7075-t6 aluminum alloy 16 compression plate 7x7mm 7075-t6 alumium alloy 17 wave spring 4 lbs 0.375" od 0.15" ln plain carbon steel 18 dowel pin, m1.5 x 20mm lg, 18-8 ss aisi 347 annealed stainless steel (ss) 19 wave spring spacer kapton polyimide/cirlex/ ultem ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: socket spec primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 11/20/2013 material: n/a finish: n/a weight: 12.22 CG-BGA-5020 drawing scale: 3:1 sheet: 4 of 4 eng: v. panavala file: CG-BGA-5020 dwg drawn by: m. raske
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